ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Integrated MEMS in package pp. 184-192(9) Authors: Bachman, Mark; Li, G.P.
Inkjet printing of conductive materials: a review pp. 193-213(21) Authors: Cummins, Gerard; Desmulliez, Marc P.Y.
A novel flip-chip interconnection process for integrated circuits pp. 214-218(5) Authors: Sugden, Mark W.; Hutt, David A.; Whalley, David C.; Liu, Changqing
The influence of test method, conductor profile and substrate anisotropy on the permittivity values required for accurate modeling of high frequency planar circuits pp. 219-231(13) Authors: III, Allen F. Horn; LaFrance, Patricia A.; Reynolds, John W.; Coonrod, John
SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes pp. 232-242(11) Authors: Vanfleteren, Jan; Loeher, Thomas; Gonzalez, Mario; Bossuyt, Frederick; Vervust, Thomas; Wolf, Ingrid De; Jablonski, Michal
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