ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
The new immersion tin generation in practical operation - a surface finish process including the world's first organic metal pp. 10-13(4) Author: Schröder, Sabine
Experiences gained manufacturing high density interconnect (HDI) printed wiring boards (PWBs) pp. 14-18(5) Author: Rapala-Virtanen, Tarja
Surface coatings for fluxless soldering of copper pp. 19-23(5) Authors: Liu, Changqing; Hutt, David A
How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can improve the reliability of printed circuit boards (PCBs) pp. 24-31(8) Authors: Weinhold, Michael; Yen, George
An introduction to laser direct imaging for high density interconnects pp. 32-35(4) Author: Omer, Udi