Ultrasonic Wave Propagation Problem in a Corroded Solder Joint

This paper deals with the formulation and the solution of two-dimensional "in-plane" ultrasonic wave propagation problem in a corroded solder joint using the Direct Boundary Integral Equation Method (DBIEM). The quantitative evaluation of ultrasonic scattered field in a multi-layered system: a printed circuit board - thin base layer - solder joint with real geometrical and mechanical properties is presented. Finally, the effect of inter-crystallite corrosion on the scattered wave field of a solder joint and its influence on the solder joint reliability is discussed.