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Investigation on Interfacial Characteristics of W/Al Nanostructure

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The objective of this paper is to provide a systematic investigation on design or evaluation for W/Al interface structure in micro/ nano electronic manufacturing. To understand the basic mechanical properties of the W/Al interface structure, the elastic modulus and the hardness of the sample were investigated by nanoindentation. To investigate the integrating characteristics of the sample in progress, the effect of thermal loading and no-thermal loading on the integrating force of the W/Al interface is tested by nanoscratch. The interfacial bonding force between the films can be obtained for understanding the integrating characteristics. The results show that the interfacial bonding force can be improved by thermal loading, which means the mechanical properties of W/Al interface can be modulated and modified by using thermal loading. It is significant for design and industrial manufacturing process of W/Al interface structure.
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Keywords: W/Al interface structure; mechanical properties; nanoindentation; nanoscratch

Document Type: Research Article

Publication date: October 1, 2013

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  • Current Nanoscience publishes authoritative reviews and original research reports, written by experts in the field on all the most recent advances in nanoscience and nanotechnology. All aspects of the field are represented including nano- structures, synthesis, properties, assembly and devices. Applications of nanoscience in biotechnology, medicine, pharmaceuticals, physics, material science and electronics are also covered. The journal is essential to all involved in nanoscience and its applied areas.
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