Effect of Bimodal Microstructure on Electrochemical Corrosion Behavior of 304 Stainless Steel in 0.5 M H2SO4 Solution
Bimodal microstructure (BMS) materials are well known for their potential use as optimized structures, possessing both high strength and ductility simultaneously. Electrochemical corrosion behavior of BMS stainless steel (SS) obtained by post-ECAP (equal-channel angular pressing) annealing was investigated by potentiodynamic polarization test, electrochemical impedance spectroscopy (EIS), potentiostatic current transient and capacitance measurement. The results indicate that the BMS SS distinguishes itself from both the coarse crystalline (CC) and nanocrystalline (NC) SS by the medium electrochemical behavior. This is attributed to the "compound" microstructure of the outer passive film on the BMS SS consisting of both the relatively compact and relatively porous parts as it results from the equivalent electrical circuit (EEC) simulation and atomic force microscopy (AFM) observation. These features of the outer passive film are in well corresponding to those of the BMS substrate. In addition, both the inner and outer passive films on the BMS SS are determined by EIS analysis to be less homogeneous as compared to the corresponding films on NC as well as on CC SS, and this is confirmed by the lower values n 1 and n 2.
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Document Type: Research Article
Publication date: September 1, 2019
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