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Numerical Simulation and Research on the Interface Structure of Wide Cu/Al Composite Plate Prepared by Solid–Liquid Composite Method

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Solid–liquid composite model of Cu/Al composite plate was set up by Fluent software to study the influence of Solid–liquid composite method (feeding speed and casting temperature of liquid Al) on the Kiss point position, the temperature field, flow field and the liquid holdup distribution of Al. The wide Cu/Al composite plate were prepared using Solid–liquid composite method. The interface bonding mechanism of Cu/Al composite plate was analyzed using TEM analysis. Results show that the metallurgical bonding effect is better when the Cu strip is without preheating, the feeding speed is 1 m/min, and the pouring temperature is 993 K. Additionally, the thickness of the interface in Cu/Al composite plate prepared by Solid–liquid composite method is about 0.3 μm, and only one kind of intermetallic compounds CuAl2 with tetragonal phase structure is generated.
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Keywords: BONDING MECHANISM; CU/AL COMPOSITE PLATE; INTERFACE; SOLID–LIQUID COMPOSITE METHOD

Document Type: Research Article

Publication date: July 1, 2018

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  • Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with author's photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.
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