Enhanced Thermal Conductivity and Thermal Performance of Polyethylene Glycol (PEG)/Modified SiO2 Composite Phase Change Material
Due to the high latent heat and non-toxic nature, polyethylene glycol (PEG) can be used in the field of thermal storage, which is difficult to be used as solid–liquid phase change materials (PCMs) caused by the low thermal conductivity and leakage of PEG. To improve the thermal energy efficiency of PEG during the phase change process, modified silica (SiO2) as a supporting material is added into PEG. Compared with pure SiO2, the SiO2 modified by PEG400 (SiO2-PEG400) enhanced the thermal conductivity and thermal enthalpy due to the decreased restriction effect of SiO2 on PEG. The thermal properties were determined by differential scanning calorimeter (DSC) and thermogravimetric analysis (TGA). The latent heat of 25% SiO2-PEG400/PEG6000 composite was 106.6 J/g, and the thermal conductivity was 0.42 Wm–1K–1 which increased by 43.3% compared to pure PEG. In addition, the initial decomposition temperature of the 25% SiO2-PEG400 composite was about 40 °C higher than that of pure PEG. This work indicated that this method is very effective in enhancing the thermal properties of PEG based PCMs.
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Document Type: Research Article
Publication date: March 1, 2018
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