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A Study on Chemical and Mechanical Properties of NiCrSn Films for Flexible Copper Interconnect

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In this work, both the adhesion properties and chemical properties of new NiCrSn alloys as a copper diffusion barrier layer on polymer substrates were examined using micro-scratch tests. The metal/polymer interfaces were examined using auger electron spectroscopy and X-ray photoemission spectroscopy. Compared to Ni-20 at% Cr alloy, the Ni-16 at% Cr-4 at% Sn alloy films have higher values of adhesion forces than that of Ni-20 at% Cr. In addition, the Ni-16 at% Cr-4 at% Sn alloy shows better wet pattering performance without remaining etch residue after wet pattering in 33% FeCl3 wet etchant. Such tendencies were explained in terms of the different types of metal oxide compounds forming at the metal/polymer interfaces which are dependent on the barrier metal's composition.
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Keywords: ADHESION FORCE; FLEXIBLE SUBSTRATE; NICRSN ALLOY; THIN FILM; WET ETCHING

Document Type: Research Article

Publication date: April 1, 2016

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  • Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with author's photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.
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