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Effect of the Chlorine Ion on Wet Etching of Molybdenum Tantalum Alloy Thin Film in Phosphoric Acid Solution

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In this research paper, the effect of chlorine ion on the electrochemical behaviors of Mo-6 at% Ta alloy thin films was investigated. As the concentration of chlorine ions in the phosphoric acid mixture increased from 0 wt% to 2 wt%, the measured corrosion current density also increased from 3 mA/cm2 to 10 mA/cm2, indicating that the chlorine ion induces passivity breakdown of the molybdenum tantalum alloy. The empirical equation for Mo-6 at% Ta dissolution was also obtained. The dissolution mechanism of Mo-6 at% Ta in acidic solution containing chlorine ion was suggested. In addition, the electrochemical impedance spectroscopy was compared with that of pure tantalum thin film.
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Keywords: ELECTROCHEMICAL BEHAVIOR; MO-6 AT% TA; PHOSPHORIC ACID; WET ETCHING

Document Type: Research Article

Publication date: April 1, 2016

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  • Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with author's photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.
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