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Fabrication of Copper Thin Film Patterns with Highly Adhesive Silver-Decorated Polydopamine Ink

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In this study, we present a simple fabrication method to quickly create copper thin film patterns from a polydopamine-based primer ink. Polydopamine (PDA) inks were prepared by autopolymerization of dopamine to obtain polymer particle suspensions. After addition of silver nitrate, silver was recovered on the surface of PDA nanoparticles. The silver-doped PDA (Ag-PDA) suspension was inkjet-printed to form various patterns, which showed great adhesion on various plastic surfaces. After immersing the printed Ag-PAD patterns in an electro-less metallization bath, highly conductive copper thin films were recovered with a resistivity of 2.5 × 10–6 Ωcm. Bending tests showed that the resistance of plated copper thin films only increase slightly after being bent repeatedly for more than 10000 cycles. Patterns of copper thin films were also fabricated to demonstrate the possibility of applying this technique for printed electronics devices.
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Document Type: Research Article

Publication date: February 1, 2015

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  • Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with author's photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.
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