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Surface Modified Graphene for Heavy Metal Ions Adsorption

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In this study, the adsorption capacity of graphene sheets before and after modification with 1-pyrenebutyric acid (PBA) via the – stacking interaction for heavy metal ions such as Cu2+, Cd2+ and Pb2+ was explored. The adsorption capacities and efficiency for heavy metal ions at different pH and contact time were also investigated. The results showed that PBA modified graphene were better adsorbent for heavy metal ions than graphene. Graphene exhibited the adsorption capacity of up to 77.3 mg/g for Cu2+, 78.5 mg/g for Cd2+ and 99.3 mg/g for Pb2+, while graphene/PBA exhibited the higher adsorption capacity of up to 92.3 mg/g for Cu2+, 85.8 mg/g for Cd2+ and 124.2 mg/g for Pb2+ at pH of 5. The adsorption isotherms study revealed that the adsorption of graphene and graphene/PBA toward Cu2+ was well described by Langmuir isotherm model. The adsorption kinetics of Cu2+ onto graphene and graphene/PBA illustrated that the adsorption data fit the pseudosecond-order models. These graphene sheets were characterized by transmission electron microscope (TEM), scanning electron microscope (SEM), dynamic light scattering (DLS) and FT-IR spectrum.

Keywords: ADSORPTION ISOTHERM; ADSORPTION KINETICS; GRAPHENE; HEAVY METAL ION; PYRENE

Document Type: Research Article

Publication date: 01 August 2013

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  • Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with author's photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.
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