Nano Palladium Catalyst Formation Assisted by Ultrasound for Electroless Copper Plating
An ultrasound-assisted activation method for electroless copper plating is presented in this study. We found that when ultrasound was applied during the activation stage, the amount of palladium (Pd) species adsorbed on substrate surfaces was higher than for samples pre-treated with
a conventional activation process without ultrasound irradiation. With this activation method, it was also shown that the adsorbed Pd species, with a size of about 10 nm, were uniformly distributed on the surfaces. Moreover, the effect of catalyst size and distribution on electroless plating
in a 30 nm trench for gap-filling is discussed.
Keywords: CAVITATION; ELECTROLESS COPPER; GAP-FILL; PD ACTIVATION; ULTRASOUND
Document Type: Short Communication
Publication date: 01 February 2017
- Nanoscience and Nanotechnology Letters (NNL) is a multidisciplinary peer-reviewed journal consolidating nanoscale research activities in all disciplines of science, engineering and medicine into a single and unique reference source. NNL provides the means for scientists, engineers, medical experts and technocrats to publish original short research articles as communications/letters of important new scientific and technological findings, encompassing the fundamental and applied research in all disciplines of the physical sciences, engineering and medicine.
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