Nitrogen-Annealed Copper Complex Synthesized Using CuO for Application to Conductive Cu Films
A Cu(II) formate complex was synthesized by reacting low-cost Cu(II) oxide (CuO) with formic acid. The formate was mixed with α-terpineol to prepare a paste, which was stencil printed onto glass slides and thermally annealed under nitrogen at 400 °C to fabricate conductive
Cu films. The Cu(II) formate decomposed and was transformed into pure Cu particles, which were sintered during annealing. A porous Cu film was obtained because of necking between the Cu particles, and the Cu film annealed for 2 h exhibited an excellent electrical resistivity of 2.13 ×
10–5 Ω·cm.
Keywords: CONDUCTIVE PASTE; CU COMPLEX; CU FILM; CUO; ELECTRICAL RESISTIVITY; ORGANOMETALLIC COMPOUND
Document Type: Short Communication
Publication date: 01 January 2016
- Nanoscience and Nanotechnology Letters (NNL) is a multidisciplinary peer-reviewed journal consolidating nanoscale research activities in all disciplines of science, engineering and medicine into a single and unique reference source. NNL provides the means for scientists, engineers, medical experts and technocrats to publish original short research articles as communications/letters of important new scientific and technological findings, encompassing the fundamental and applied research in all disciplines of the physical sciences, engineering and medicine.
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