Skip to main content
padlock icon - secure page this page is secure

Self-Controlled Synthesis of Microscale Silicide Embossments and Pits with Multi-Shape and Orientation

Buy Article:

$106.34 + tax (Refund Policy)

By high temperature annealing of silicon wafers with thin Cu and Fe films deposited on, we got the silicides embossments (SEs)/silicon etching pits (SEPs) with different morphologies. Microscale triangle, square and wire-like SEs/SEPs were obtained on Si(111), Si(100) and Si(110) substrates, respectively. The synthesis of SEs/SEPs was closely related to temperature and orientation of Si substrates. We got copper silicides embossments at 950 °C but silicon etching pits at 1100 °C. The size of SEs/SEPs can be changed from hundred nm to several μm. We analyzed the morphological evolution and formation mechanism from SEs to SEPs with comparing samples of different temperature. This simple and practicable work may help to develop new technology for Si-based nanofabrication and to find potential functional nanomaterials in the future.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics

Keywords: ANNEALING; CU–FE CATALYZE; SILICIDE EMBOSSMENT; SILICON ETCHING PIT

Document Type: Short Communication

Publication date: November 1, 2015

More about this publication?
  • Nanoscience and Nanotechnology Letters (NNL) is a multidisciplinary peer-reviewed journal consolidating nanoscale research activities in all disciplines of science, engineering and medicine into a single and unique reference source. NNL provides the means for scientists, engineers, medical experts and technocrats to publish original short research articles as communications/letters of important new scientific and technological findings, encompassing the fundamental and applied research in all disciplines of the physical sciences, engineering and medicine.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more