Study of Adhesion Strength of Electroplated Copper to Polyimide Using Different Types of Tie Layers
We report here an excellent surface modification method of the combination of MEVVA(Metal vacuum vapor arc) and FCVA(Filter cathode vapor arc) system for polyimide (PI). In the present work, surface properties of unmodified and modified polyimide were characterized by scanning electron
microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and static contact angle measurements. In addition, adhesion strength between PI and outer Cu film was also studied by home-made 90 degree peel strength tester before and after thermal aging. It should be noted
that the adhesion strength of Ni/Ni/PI was improved significantly and reached a value up to 70.2 g/mm, in addition to an increase of surface hydrophilicity of the polyimide films after plasma treatment.
Keywords: ADHESION; FCVA; MEVVA; POLYIMIDE (PI); SURFACE MODIFICATION
Document Type: Short Communication
Publication date: 01 March 2015
- Nanoscience and Nanotechnology Letters (NNL) is a multidisciplinary peer-reviewed journal consolidating nanoscale research activities in all disciplines of science, engineering and medicine into a single and unique reference source. NNL provides the means for scientists, engineers, medical experts and technocrats to publish original short research articles as communications/letters of important new scientific and technological findings, encompassing the fundamental and applied research in all disciplines of the physical sciences, engineering and medicine.
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