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Open Access Weldability and mechanical properties of ultrasonic spot welded Cu/Cu joints

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Ultrasonic spot welded Cu/Cu joints with and without Cu nanoparticles (Cu NPs) interlayer were successfully achieved. Cu NPs interlayer, possessing the characteristics of high hardness and low melt point, could promote to eliminate the un-contacted areas in the weld interface and generate more effectively net welded areas, leading to the increase of bond density. The peak T-peel force (279.6 N) of the Cu/Cu joint with Cu NPs interlayer was 18.3% higher than that (236.3 N) of the Cu/Cu joint without Cu NPs interlayer. In addition, for the Cu/Cu joint with Cu NPs interlayer, only welded regions with obvious facture dimples could be observed in the fracture morphology.

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Keywords: BOND DENSITY; CU SHEET; MECHANICAL PROPERTY; MICROSTRUCTURE; WELDING

Document Type: Miscellaneous

Publication date: February 1, 2019

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  • Materials Express is a peer-reviewed multidisciplinary journal reporting emerging researches on materials science, engineering, technology and biology. Cutting-edge researches on the synthesis, characterization, properties, and applications of a very wide range of materials are covered for broad readership; from physical sciences to life sciences. In particular, the journal aims to report advanced materials with interesting electronic, magnetic, optical, mechanical and catalytic properties for industrial applications.
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