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Femtosecond Laser Ablating Depth for Nanometer-Sized Thin Metal Films

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Femtosecond laser machining for nanometer-sized metal thin films is a key process commonly required in the manufacturing of modern electronic devices. It is generally known that thermal transport in nanometer-sized devices and in ultrashort process may deviate from the Fourier's law. This possibly leads to different ablation characteristics from conventional laser processing. This paper employs a two-temperature model with the vaporization at solid–vapour interface to analyze the thermal process for femtosecond laser ablation of the metal film. The ablation depth per pulse predicted by this work agrees with the available measured data. The effects of material properties on the ablated depth are also discussed.
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Keywords: Ablated Depth; Femtosecond Laser; Metal Film

Document Type: Research Article

Affiliations: 1: Department of Mechanical Engineering, Hwa Hsia University of Technology, Taipei 235, Taiwan 2: Department of Chinese Medicine, Buddhist Dalin Tzu Chi General Hospital, Chiayi 622, Taiwan 3: Department of Mechanical Engineering, Cheng Shiu University, Kaohsiung 833, Taiwan

Publication date: August 1, 2017

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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