Computational Study of Electrohydrodynamic Jet Printing with Block-Copolymer Inks
Directed self-assembly (DSA) enables to fabricate below 10-nm patterns. However, DSA has patterning limitation of spin coating to define arbitrary patterns with various sizes, periodicities, and morphologies in a wafer. Electrohydrodynamic (E) jet printing with block copolymer (BCP) inks can create BCP patterning with complex structures and tunable periodicities across a large substrate. In this paper, E-jet printing with BCP inks is computationally modeled to reduce this process complexity. For E-jet printing, analytical methods are described for jet radius, surface charge density, jet velocity, electric field, and working distance. BCP patterning is simulated by using the dissipative particle dynamics (DPD). Simulation results can agree well with experimental results within the allowable range. Among process parameters of E-jet printing with BCP inks, working distance, volume fraction, molecular weight, and a maximum repulsion factor between PS and PMMA particles are dominant factors on BCP random patterns.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
Document Type: Research Article
Affiliations: Hongik University, Department of Science, Seoul 121-791, Republic of Korea
Publication date: August 1, 2017
More about this publication?
- Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Terms & Conditions
- Ingenta Connect is not responsible for the content or availability of external websites