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Synthesis of High Aspect-Ratio Copper Nanowires for One-Dimensional Fillers in Conductive Fibers

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In this work, we report a facile route to synthesize high aspect-ratio copper nanowires (Cu NWs) in an aqueous solution for one-dimensional filler in conductive fibers. From the syntheses with various types of capping agents, we found that the capping agents with higher molecular weight (oleylamine and hexadecylamine) were more favorable in obtaining high aspect-ratio Cu NWs compared to those with lower molecular weight (ethylenediamine and butylamine). Also, it was observed that the amount of the capping agent was one of the key factors in obtaining high aspect-ratio nanowires while suppressing the growth of cubic-structured or spherical nanoparticles during the synthesis. From these results, we believe that the synthesized Cu NWs could be a possible candidate for one-dimensional filler in conductive fibers which require high electrical conductivity as well as high mechanical flexibility.

Keywords: Capping Agent; Copper Nanowire; High Aspect Ratio; One-Dimensional Filler

Document Type: Research Article

Affiliations: 1: School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Korea 2: SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Korea 3: School of Electrical and Electronic Engineering, Chung-Ang University, Seoul 06974, Korea

Publication date: 01 November 2016

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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