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Effect on Thickness of Al Layer in Poly-Crystalline Si Thin Films Using Aluminum(Al) Induced Crystallization Method

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The polycrystalline silicon (poly-Si) thin films were prepared by aluminum induced crystallization. Aluminum (Al) and amorphous silicon (a-Si) layers were deposited using DC sputtering and plasma enhanced chemical vapor deposition method, respectively. For the whole process Al properties of bi-layers can be one of the important factors. In this paper we investigated the structural and electrical properties of poly-crystalline Si thin films with a variation of Al thickness through simple annealing process. All samples showed the polycrystalline phase corresponding to (111), (311) and (400) orientation. Process time, defined as the time required to reach 95% of crystalline fraction, was within 60 min and Al(200 nm)/a-Si(400 nm) structure of bi-layer showed the fast response for the poly-Si films. The conditions with a variation of Al thickness were executed in preparing the continuous poly-Si films for solar cell application.
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Document Type: Research Article

Publication date: February 1, 2011

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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