New Synthesis Approach for Low Temperature Bimetallic Nanoparticles: Size and Composition Controlled Sn–Cu Nanoparticles
A various size of Sn–Cu nanoparticles were synthesized by using a modified polyol process for low temperature electronic devices. Monodispersive Sn–Cu nanoparticles with diameters of 21 nm, 18 nm and 14 nm were synthesized. In addition, the eutectic composition shift was also observed in nano-sized particles as compared with bulk alloys. By controlling the size and eutectic composition, a significant melting temperature depression of 30.3 °C was achieved. These melting temperature depression approaches will reduce adverse thermal effects in electronic devices and provide the synthesis guidelines for bimetallic nanoparticles with a low melting temperature.
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Document Type: Research Article
Publication date: February 1, 2011
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