A Low Sintering Temperature and Electrical Performance of Nanoparticle Copper Ink for Use in Ink-Jet Printing
Copper nanoparticles were successfully synthesized from copper chloride with various capping agents. The formation of copper nanoparticles was controlled by varying the species and concentration of the capping agents. The Cu nanoparticles were easily re-dispersed into n-tetradecane, and Cu films were prepared by solution deposition. The thin Cu films form a highly conducting film at low temperature via sintering due to the high surface area to volume ratio. The films were thermally treated at a range of temperatures and then their morphology and resistivity were analyzed. When the Cu films were sintered at 200 °C, their electrical resistivity was about 40 μΩ·cm.
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Document Type: Research Article
Publication date: October 1, 2010
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