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Epoxy Resin Filled with High Volume Content Nano-SiO2 Particles

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Mechanical and thermal properties of SiO2/epoxy nanocomposites with almost uniformly dispersed nanoparticles were thoroughly investigated in this study. Young's modulus, tensile strength and fracture toughness of epoxy resin were simultaneously improved with SiO2 nanoparticles up to 14 vol.%. Atomic force microscopy was carried out in order to detect the nanoparticle-matrix interphase. It was found that the interphase region became harder than the bulk matrix, due to the higher crosslink density in the interphase region. Differential scanning calorimetry was applied to investigate the curing behaviors of nano-SiO2/epoxy composites. The presence of nano-SiO2 had little effects on the curing reaction. In addition, the glass transition temperature of epoxy resin dropped slightly with the increased nano-SiO2 content.
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Document Type: Research Article

Publication date: February 1, 2009

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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