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Novel Lead-Free Sn-Cu-xBi Nanosolders by Chemical Reduction Method

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With environmental concerns on the toxicity of lead, investigations on lead-free solders become crucial. Studies on lowering process temperature of lead-free solders are required, because the melting points of lead-free solders are higher than original SnPb solders. Melting points of binary solders could be decreased by addition another materials. In this study, Sn-Cu-xBi lead-free nanoparticles were synthesized with precisely controlled size and composition by chemical precipitation method. Effects of different precursor concentration and surfactant addition were discussed. The influence of different amounts of Bi in the SnCu-based nano-particles was also probed.
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Document Type: Research Article

Publication date: February 1, 2009

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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