Analysis on Residual Stress in Cu Film on Fe Substrate-Based on Electron Theory
The average residual stress in electroplated Cu film on Fe substrate was measured in situ by cantilever beam test. The origin and the distribution of the residual stress in Cu film were investigated. The results show that the average residual stress and the distributed residual stress in Cu film were tensile stress and decrease with the increase of film thickness. The interfacial stress in Cu film is very large and the growth stress is very small. The average residual stress in Cu film, which was caused by the interfacial stress, was calculated roughly using a modified Thomas–Feimi–Dirac electron theory (TFDC). The experimental value of the average residual stress and the theoretical value were both tensile stress and were about equal. It shows that the theoretical calculation model of residual stress is of accuracy.
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Document Type: Research Article
Publication date: September 1, 2012
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