Interactions Between Copper and Silicon Nanofilms with Nanogap: A Molecular Dynamics Investigation
Molecular dynamics simulations concerning behaviors of interactions between closely spaced copper and silicon nanofilms have been carried out by using the Lennard-Jones (L-J) potential. When the gap between the two films narrowing from 20 to 3 Å, the interaction strength firstly
keeps almost unchanged and then decreases quickly. The critical gap is found to be around 7 Å. Moreover, the interaction strength decreases with the decreasing temperature and can change from repulsive type into attractive type. It also varies with different surface morphologies, including
surface roughness and groove size. However, it is little affected by the approaching velocity of the two films.
Keywords: INTERACTION ENERGY; MOLECULAR DYNAMICS; NANOFILMS; SURFACE MORPHOLOGY; TEMPERATURE; VELOCITY
Document Type: Research Article
Publication date: 01 July 2012
- Journal of Computational and Theoretical Nanoscience is an international peer-reviewed journal with a wide-ranging coverage, consolidates research activities in all aspects of computational and theoretical nanoscience into a single reference source. This journal offers scientists and engineers peer-reviewed research papers in all aspects of computational and theoretical nanoscience and nanotechnology in chemistry, physics, materials science, engineering and biology to publish original full papers and timely state-of-the-art reviews and short communications encompassing the fundamental and applied research.
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