Interfacial Stresses Analyses of Anisotropic Conductive Adhesive Bonding Under Thermal and Humidity Loads
The reliability of anisotropic conductive adhesive films (ACFs) bonding under thermal and humidity loads has been carried out by means of the interfacial stresses analysis. Beam theory models were used to derive the integral equation through the beam element analysis. The shear stresses and normal stresses of the interface was obtained by solving the integral equations. The simulated results of finite element analysis well agree with the calculated ones by beam theory models. The effects of the material and geometry parameters on the interfacial stresses were also investigated.
Keywords: ANISOTROPIC CONDUCTIVE ADHESIVE FILMS (ACFS); INTERFACIAL STRESSES ANALYSIS; THERMAL AND HUMIDITY LOADS
Document Type: Research Article
Publication date: 01 August 2008
- Journal of Computational and Theoretical Nanoscience is an international peer-reviewed journal with a wide-ranging coverage, consolidates research activities in all aspects of computational and theoretical nanoscience into a single reference source. This journal offers scientists and engineers peer-reviewed research papers in all aspects of computational and theoretical nanoscience and nanotechnology in chemistry, physics, materials science, engineering and biology to publish original full papers and timely state-of-the-art reviews and short communications encompassing the fundamental and applied research.
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