Structural and Adhesion Properties of Thin Films for a Flexible Connector Application
The work presents the authors' results regarding vacuum evaporated thin films (Al, Cr and Ti) on polymer substrate (polyethylene terephtalate support sheet) for a flexible connector application. Microstructure, internal stresses and adhesion of the investigated thin film/substrate systems
were studied. The X-ray diffraction (XRD) and atomic force microscopy (AFM) methods were used in this research. Interesting conclusions concerning the correlation between structure and adhesion, influenced by the substrate treatment and thin film deposition parameters, have been inferred.
Keywords: ADHESION; AFM; FLEXIBLE CONNECTOR; MICROSTRUCTURE; THIN FILM; XRD
Document Type: Research Article
Publication date: 01 May 2011
- Journal of Advanced Microscopy Research (JAMR) provides a forum for rapid dissemination of important developments in high-resolution microscopy techniques to image, characterize and analyze man-made and natural samples; to study physicochemical phenomena such as abrasion, adhesion, corrosion and friction; to perform micro and nanofabrication, lithography, patterning, micro and nanomanipulation; theory and modeling, as well as their applications in all areas of science, engineering, and medicine.
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