Factors Contributing to the Defect in Wafer Fabrication Process: A Case Study of Manufacturer in Semiconductors Product
Semiconductors are the foundation of modern solid state electronics, including transistor, solar cells, lightemitting diodes (LED) and analog integrated circuits. Nowadays, around 95% of all semiconductors are fabricated by silicon. Silicon needs to undergo a wafer fabrication process such as slicing; grinding, etching and polishing. As manufacturing process become complicated, few factors will lead to defect in wafer fabrication process which one of it contamination during wafer fabrication process. High contaminant will cause defect of wafer and drastically reduce coating adhesion on the wafer or chip. This contaminant also can be the sources for killing circuit. Once the circuit is affected with contamination, the quality of product will destroy and it will lead to defect and incurred high cost of operations. This study will investigate why contamination occur during wafer fabrication process and the effect of this contamination towards quality of silicon. After identify the factor and effects toward defects in wafer fabrication process, this research will further investigate how to minimize the defect during wafer fabrication process.
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Document Type: Research Article
Affiliations: Faculty of Business and Management, Universiti Teknologi MARA, Puncak Alam Campus, 42300 Selangor Darul Ehsan, Malaysia
Publication date: July 1, 2018
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