Graphene and nanoscale composite have been studied a lot. The existing researches have the strengths of good electric conductivity, a high level of specific surface area, electro-activity and so on, but practical synthesis method in large quantities has not been developed enough, and
applicable technology has been very limited at industry field because of cost. This study is about electronic heat sink and the methods to produce it through the ways to improve more innovatively not only thermal diffusion of horizontal direction but also thermal conductivity of vertical direction
by filling the gaps existing in the desquamated graphite sheet with amorphous carbon particles. Amorphous carbon particles are thermal isotropy, their structure consists of very fine crystals of graphite and diamond, and their desirable size is between 10 nm to 110 nm. Based on the existing
researches, when graphite and ABS composite are combined, heat transfer was carried out more practically than before at industrial field. This complex has good impact resistance, chemical resistance, proof against climate and etc., and has been confirmed to be a heat-radiating composition
of good second workability with excellent moldability, such as injection molding and extrusion molding.
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Document Type: Research Article
Department of Graduate School Science Education, Dankook University, Korea
Department of Information and Communication Engineering, Myongji University, Gyeonggi-do, Korea
Publication date: November 1, 2016
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ADVANCED SCIENCE LETTERS is an international peer-reviewed journal with a very wide-ranging coverage, consolidates research activities in all areas of (1) Physical Sciences, (2) Biological Sciences, (3) Mathematical Sciences, (4) Engineering, (5) Computer and Information Sciences, and (6) Geosciences to publish original short communications, full research papers and timely brief (mini) reviews with authors photo and biography encompassing the basic and applied research and current developments in educational aspects of these scientific areas.
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