Structural and Magnetic Behavior of Cu/Ni Bilayer on Si(100) Surface
Cu/Ni thin films were deposited onto Si(100) substrate at room temperature by thermal evaporation of 99.99% pure Cu and Ni metals in high vacuum of 2.0 × 10–5 mbar. The structural and magnetic properties were investigated using X-ray Diffractometer (XRD), Atomic
Force Microscope (AFM), X-ray Photoelectron Spectroscopy (XPS) and Superconducting Quantum Interference device (SQUID) techniques. The XRD pattern of the Cu/Ni reveals the formation of bilayer on Si(100) substrate with average crystallite size is about 35 nm and well supported by AFM microstructure
study. XPS studies indicate the presence of pure Cu on the surface after sputtering with argon ion beam. Some amount of Ni is observed at the interface which interacts with Cu. The peak of Cu 2p3/2 occurs at 932.4 eV binding energy with a spin orbit separation of about 19.9 eV where
as the Ni 2p3/2 peak occurs at 853.0 eV with a spin orbit splitting of 17.5 eV. Cu/Ni bilayer exhibits weak ferromagnetism at room temperature due to interaction of Cu with Ni at the interface.
Keywords: ATOMIC FORCE MICROSCOPY; SUPERCONDUCTING QUANTUM INTERFERENCE DEVICE; THIN FILMS; X-RAY PHOTOELECTRON SPECTROSCOPY
Document Type: Research Article
Publication date: 01 February 2016
- ADVANCED SCIENCE LETTERS is an international peer-reviewed journal with a very wide-ranging coverage, consolidates research activities in all areas of (1) Physical Sciences, (2) Biological Sciences, (3) Mathematical Sciences, (4) Engineering, (5) Computer and Information Sciences, and (6) Geosciences to publish original short communications, full research papers and timely brief (mini) reviews with authors photo and biography encompassing the basic and applied research and current developments in educational aspects of these scientific areas.
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Ingenta Connect is not responsible for the content or availability of external websites
- Access Key
- Free content
- Partial Free content
- New content
- Open access content
- Partial Open access content
- Subscribed content
- Partial Subscribed content
- Free trial content