Skip to main content
padlock icon - secure page this page is secure

Structural and Magnetic Behavior of Cu/Ni Bilayer on Si(100) Surface

Buy Article:

$106.34 + tax (Refund Policy)

Cu/Ni thin films were deposited onto Si(100) substrate at room temperature by thermal evaporation of 99.99% pure Cu and Ni metals in high vacuum of 2.0 × 10–5 mbar. The structural and magnetic properties were investigated using X-ray Diffractometer (XRD), Atomic Force Microscope (AFM), X-ray Photoelectron Spectroscopy (XPS) and Superconducting Quantum Interference device (SQUID) techniques. The XRD pattern of the Cu/Ni reveals the formation of bilayer on Si(100) substrate with average crystallite size is about 35 nm and well supported by AFM microstructure study. XPS studies indicate the presence of pure Cu on the surface after sputtering with argon ion beam. Some amount of Ni is observed at the interface which interacts with Cu. The peak of Cu 2p3/2 occurs at 932.4 eV binding energy with a spin orbit separation of about 19.9 eV where as the Ni 2p3/2 peak occurs at 853.0 eV with a spin orbit splitting of 17.5 eV. Cu/Ni bilayer exhibits weak ferromagnetism at room temperature due to interaction of Cu with Ni at the interface.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics


Document Type: Research Article

Publication date: February 1, 2016

More about this publication?
  • ADVANCED SCIENCE LETTERS is an international peer-reviewed journal with a very wide-ranging coverage, consolidates research activities in all areas of (1) Physical Sciences, (2) Biological Sciences, (3) Mathematical Sciences, (4) Engineering, (5) Computer and Information Sciences, and (6) Geosciences to publish original short communications, full research papers and timely brief (mini) reviews with authors photo and biography encompassing the basic and applied research and current developments in educational aspects of these scientific areas.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more