A Study on the Reliability of Micro-Vias in Printed Circuit Boards During Thermal Cycling
Reliability of Micro-vias in printed circuit board (PCB) for mobile phone are usually evaluated by experiment method. But it takes much time and costs obtaining reliability data from experimental method. Further it so hard to analyze reliability mechanism by using experimental data. So, recently many reliability researches were worked by numerical method such as FEM. In this paper, equivalent von Mises stress and equivalent plastic strain by thermal deformation of micro-via have been analyzed by FEM to predict crack occurring positions and to understand why reliability issue happened in there. For finite element analysis conventional micro-vias and IVH (Inner Via Hole) were modeled. Thermal cycle test (TCT) condition of 100 cycles was considered. TCT of 1 cycle includes cooling down from 25 °C to −65°C and heating up to 125 °C and cooling down to 25 °C. Calculated results show that the equivalent von Mises stress and equivalent plastic strain occurred locally at bottom area of micro-via. Also, equivalent plastic strain increases as TCT increases.
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Document Type: Research Article
Publication date: December 1, 2013
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