Experimental Evaluation of Selective Adhesive Coating in Chip Transfer Process for Flexible Electronic Substrates Using Atmospheric Plasma
This paper presents adhesion control process using atmospheric plasma to flexible substrate for selective coating of adhesive. It covers the method of hydrophilic process using the atmospheric plasma system that has a plasma gun being located over a target surface and providing the argon, oxygen and nitrogen gases. And it also presents the method of hydrophobic process using HMDSO (Hexamethyldisiloxane) vaporized by the argon gas. PET or PI films are used as a target flexible surface, the surfaces are processed through the atmospheric plasma system and analyzed by measuring the contact angles. The atmospheric plasma system uses the argon, oxygen, nitrogen gases and the vaporized HMDSO for hydrophobic process. The HMDSO is the chemical mixture having the molecular formula as O[Si(CH3)3]2. It is used as a liquid material for protecting the film formed after the evaporation or sputtering processes, generally it is applied to the SiOx film formation process. Meanwhile, the hydrophilic surface can be acquired by the system excluding the HMDSO, only using the argon, oxygen and nitrogen gases. Several basic experiments are performed in order to get better surface (hydrophobic or hydrophilic) and analyze the factors and its contributions. The substrates processed by this system are analyzed by measuring the contact angle. DI (deionized) water is used generally to measure the contact angles, additionally UV(ultra-violet) curable adhesive is used in order to analyze its behavior on the flexible substrate. In addition, selective surface treatment process using masking technique and adhesive coating process are introduced. Finally it presents the possibility of adhesive coating for selective area to the flexible substrate through these processes.
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Document Type: Research Article
Publication date: December 1, 2013
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