Skip to main content
padlock icon - secure page this page is secure

Three-dimensional automatic routing for the design of moulded interconnect devices

Buy Article:

$61.00 + tax (Refund Policy)

One of the fundamental innovations in the field of mechatronics is the direct material integration of mechanical and electronic functions through using moulded interconnect devices (MID) technology. Unlike conventional circuit boards, they are not limited to two dimensions but offer the possibility to arbitrarily lay printed circuit traces on the surfaces of the three-dimensional carrier. Traditional 2D layout function in electronic computer aided design (ECAD), especially automatic routing algorithm cannot be directly applied in MID. In this article, two 3D routing algorithms with their own advantages and disadvantages are presented. The related 3D routing functions, which are not supported by conventional mechanic CAD (MCAD) and ECAD systems, have been integrated in the design system MIDCAD. With these 3D routing functions, MIDCAD enables a more effective product design based on the MID technology.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics

Keywords: algorithm; automatic routing; moulded interconnect devices (MID); three dimensional

Document Type: Research Article

Affiliations: Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, China

Publication date: April 1, 2011

More about this publication?
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more