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A new lead-to-pad alignment technique for surface-mount component placement

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The criterion for an acceptable assembly of a surface-mounted printed circuit board is that leads of surface- mount components must have a minimum acceptable surface contact with their corresponding pads. The higher the minimum surface contact the more reliable the assembly. Most surface-mount component placement systems use a component-to-pad alignment technique for placement of surface-mount components. This alignment technique does not guarantee maximum lead-to-pad surface contact due to errors in leads and pads. In this paper,a lead-to-pad alignment technique for placement of surface-mount components is presented.
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Document Type: Research Article

Publication date: March 1, 1998

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