Cardboard-Based Packaging Materials as Renewable Thermal Insulation of Buildings: Thermal and Life-Cycle Performance
Experimental measurements were performed to identify the thermal performance of studied cardboard packaging materials. Real-size samples were experimentally tested in laboratory measurements. The thermal resistance and conductivity of all the analyzed samples were measured according to the procedure indicated in the ISO8032 standard. A life-cycle assessment according to ISO 14040 was also performed to evaluate the environmental impacts related to the production of these materials. The results show that cardboard panels are a material with thermal and environmental properties on par with contemporary thermal insulations. Depending on their structure, the measured thermal conductivity varies from 0.05 to 0.12 W·m–1·K–1 and their environmental impacts are much lower than those of polyisocyanurate foam or mineral wool.
Document Type: Research Article
Publication date: 01 January 2017
This article was made available online on 28 April 2017 as a Fast Track article with title: "Cardboard-Based Packaging Materials as Renewable Thermal Insulation of Buildings: Thermal and Life-Cycle Performance".