ISSN 1356-5362 (Print)
Publisher: Emerald Group Publishing Limited
Some results obtained with diffusion patterning technology pp. 7-18(12) Authors: Belavic, Darko; Hrovat, Marko; Pavlin, Marko; Holc, Janez
Development of a reliable packaging process for flip chip on ceramics pp. 19-22(4) Author: Zhong, Zhaowei
Thick film microstrip rejection filter with improved Q using overlay pp. 23-28(6) Authors: Rane, Sunit; Puri, Vijaya
New approach for calculation of line parameters of IC interconnects pp. 29-31(3) Authors: Ymeri, Hasan; Nauwelaers, Bart; Maex, Karen; Roest, David De
Substrate characterization: simulation and measurement at high microwave frequencies pp. 32-34(3) Authors: Free, Charles; Tian, Zhengrong; Barnwell, Peter
Computational and experimental approach to thermal management in microelectronics and packaging pp. 35-39(5) Authors: Furlong, Cosme; Pryputniewicz, Ryszard J
Effects of aspect ratio on the temperature coefficient of resistance matching and low frequency noise levels in thick film strain sensors pp. 40-43(4) Authors: Atkinson, J.K.; Sion, R.P.; Zhang, Z
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