ISSN 1356-5362 (Print)
Publisher: Emerald Group Publishing Limited
The past, present and future of EEE components for space application: COTS - the next generation pp. 7-16(10) Authors: Wall, John; Sinnadurai, Nihal
Future trends in materials for lightweight microwave packaging pp. 17-21(5) Authors: Jacobson, David M; Sangha, Satti P.S.
Frits in thick film superconductors: a special approach for improving superconducting and adhesion properties pp. 22-25(4) Authors: Harsányi, Gábor; Liu, Yanqing; Jones, W Kinzy
Silicon pressure sensors with a thick film periphery pp. 26-30(5) Authors: Belaviˇc, Darko; ˇSoba, Stojan; Pavlin, Marko; Roˇcak, Dubravka; Hrovat, Marko
Studying electro-physical material characteristics of vacuum-deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups pp. 31-35(5) Authors: Philippov, Ph.; Arnaudov, R; Yordanov, N; Ianev, V; Gospodinova, M
A new concept for the use of Al-sheet as integrated substrate for one or multichip module package pp. 36-41(6) Authors: Philippov, Ph.; Arnaudov, R; Yordanov, N; Gospodinova, M
The role of selective electroplating in the construction of advanced circuit boards pp. 42-48(7) Author: Moran, Peter
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