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Publisher: Emerald Group Publishing Limited

Volume 41, Number 2, 2015

Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability
pp. 55-60(6)
Authors: Wang, Shouxu; Xuemei He State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China; Wei He State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China AND Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou, China; Silberschmidt, Vadim V.; Tan, Ze

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Influence of the cavities on the PCB mechanical properties
pp. 76-79(4)
Authors: Otáhal, Alexandr; Szendiuch, Ivan

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Printed electrodes for flexible, light-weight solid-state supercapacitors â–“ a feasibility study
pp. 80-86(7)
Authors: York, Nicola; Southee, Darren; Wijayantha, K.G.U.

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Mechanical drilling of PCB micro hole and its application in micro ultrasonic powder molding
pp. 87-94(8)
Authors: Li, Bing; Fu, Lianyu; Wu, Xiaoyu; Shi, Hongyan; Peng, Taijiang; Xu, Bin

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