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Publisher: Emerald Group Publishing Limited

Volume 39, Number 3, 2013

PCB failure analysis related to the ENIG black pad problem
pp. 124-132(9)
Authors: Ramanauskas, Rimantas; Selskis, Algirdas; Juodkazyte, Jurga; Jasulaitiene, Vitalija

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Failure mechanism of solder bubbles in PCB vias during high-temperature assembly
pp. 133-138(6)
Authors: Chen, Yuanming; He, Wei; Zhou, Guoyun; Tao, Zhihua; Wang, Yang; Luo, Daojun

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A solution for micro drill condition monitoring with vibration signals for PCB drilling
pp. 147-152(6)
Authors: An, Qinglong; Dong, Dapeng; Zheng, Xiaohu; Chen, Ming; Wang, Xibin

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