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Publisher: Emerald Group Publishing Limited

Volume 38, Number 4, 2012

Integrated MEMS in package
pp. 184-192(9)
Authors: Bachman, Mark; Li, G.P.

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Inkjet printing of conductive materials: a review
pp. 193-213(21)
Authors: Cummins, Gerard; Desmulliez, Marc P.Y.

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A novel flip-chip interconnection process for integrated circuits
pp. 214-218(5)
Authors: Sugden, Mark W.; Hutt, David A.; Whalley, David C.; Liu, Changqing

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SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes
pp. 232-242(11)
Authors: Vanfleteren, Jan; Loeher, Thomas; Gonzalez, Mario; Bossuyt, Frederick; Vervust, Thomas; Wolf, Ingrid De; Jablonski, Michal

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