Skip to main content

Publisher: Emerald Group Publishing Limited

Volume 35, Number 4, 2009

Favourites:
ADD

High aspect ratio "multiple wire" microvias in flexible PCBs
pp. 18-21(4)
Authors: Lindeberg, Mikael; Hjort, Klas

Favourites:
ADD

Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards
pp. 22-30(9)
Authors: Laine-Ma, Teija; Ruuskanen, Pekka; Kortet, Satu; Karttunen, Mikko

Favourites:
ADD

Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)
pp. 31-39(9)
Authors: Das, Rabindra N.; Rosser, Steven G.; Papathomas, Konstantinos I.; Antesberger, Tim; Markovich, Voya R.

Favourites:
ADD

Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP)
pp. 40-45(6)
Authors: Cai, Xiong-hui; An, Bing; Wu, Feng-shun; Wu, Yi-ping

Favourites:
ADD

High quality laser cutting of electronic printed circuit board substrates
pp. 46-55(10)
Authors: Wang, X.C.; Zheng, H.Y.

Favourites:
ADD

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content