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Publisher: Emerald Group Publishing Limited

Volume 35, Number 4, 2009

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High aspect ratio "multiple wire" microvias in flexible PCBs
pp. 18-21(4)
Authors: Lindeberg, Mikael; Hjort, Klas

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Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards
pp. 22-30(9)
Authors: Laine-Ma, Teija; Ruuskanen, Pekka; Kortet, Satu; Karttunen, Mikko

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Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)
pp. 31-39(9)
Authors: Das, Rabindra N.; Rosser, Steven G.; Papathomas, Konstantinos I.; Antesberger, Tim; Markovich, Voya R.

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Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP)
pp. 40-45(6)
Authors: Cai, Xiong-hui; An, Bing; Wu, Feng-shun; Wu, Yi-ping

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High quality laser cutting of electronic printed circuit board substrates
pp. 46-55(10)
Authors: Wang, X.C.; Zheng, H.Y.

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