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Publisher: Emerald Group Publishing Limited

Volume 35, Number 2, 2009

A direct-writing approach to the micro-patterning of copper onto polyimide
pp. 3-17(15)
Authors: Ng, J.H.-G.; Desmulliez, M.P.Y.; Lamponi, M.; Moffat, B.G.; McCarthy, A.; Suyal, H.; Walker, A.C.; Prior, K.A.; Hand, D.P.

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Cracking phenomena on flexible-rigid interfaces in PCBs under thermo cycling loading
pp. 18-22(5)
Authors: Arruda, Luciano; Bonadiman, Renato; Costa, Josineto; Reinikainen, Tommi

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A multilayer process for the connection of fine-pitch-devices on molded interconnect devices (MIDs)
pp. 23-29(7)
Authors: Leneke, Thomas; Hirsch, Soeren; Schmidt, Bertram

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Low-power noise multilayer PCB with discrete decoupling capacitors inside
pp. 30-36(7)
Authors: Song, Ki-Jae; Kim, Jongmin; Yoo, Jongwoon; Nah, Wansoo; Lee, Jaeil; Sim, Hyunseop

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Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder
pp. 37-44(8)
Authors: Hetschel, Thomas; Wolter, Klaus-J├╝rgen; Phillipp, Fritz

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