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Publisher: Emerald Group Publishing Limited

Volume 33, Number 3, 2007

How to make chip integration technology suitable for high volume production
pp. 3-8(6)
Authors: Gottwald, Thomas; Ockenfuß, Ulrich

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Prognostics of ceramic capacitor temperature-humidity-bias reliability using Mahalanobis distance analysis
pp. 21-28(8)
Authors: Nie, Lei; Azarian, Michael H.; Keimasi, Mohammadreza; Pecht, Michael

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