ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Regulations and market trends in lead-free and halogen-free electronics pp. 4-9(6) Authors: Nie, Lei; Pecht, Michael; Ciocci, Richard
Printed circuit boards for lead-free soldering: materials and failure mechanisms pp. 10-16(7) Authors: Johander, Per; Tegehall, Per-Erik; Osman, Abelrahim Ahmed; Wetter, Göran; Andersson, Dag
New epoxy resins for printed wiring board applications pp. 17-27(11) Authors: Hoevel, Bernd; Valette, Ludovic; Gan, Joseph
Lead/halogen-free laminates and their effect on desmearing and metallisation pp. 28-35(8) Author: Patton, Neil
Selection and qualification of polymers for rigid and flexible interconnect applications pp. 36-42(7) Authors: Schuessler, Florian; Feldmann, Klaus; Bigl, Thomas
The advantages of mildly alkaline immersion silver as a final finish for solderability pp. 43-51(9) Authors: Fang, Jing Li; Chan, Daniel K.
An integrated approach to electronic waste (WEEE) recycling pp. 52-58(7) Authors: Dalrymple, I.; Wright, N.; Kellner, R.; Bains, N.; Geraghty, K.; Goosey, M.; Lightfoot, L.
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