ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Intermetallic compound formation and solderability for immersion tin
Chan, C.M.; Tong, K.H.; Kwok, R.W.M.
Influence of the binder system on current and future demands for base materials
Hoevel, Bernd; Valette, Ludovic; Aoyama, Tomoyuki
Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass-production and packaging manufacturers?
New technologies for a sustainable printed circuit board manufacturing process: further results
Bains, Narinder; Geraghty, Kate; Goosey, Martin
European printed circuit board (PCB) technology and environmental trends: their impact on PCB supply from China
Weinhold, Michael K.
Technology roadmapping and the supply chain
Fisher, John T. (Jack)
Brominated flame retardants: their potential impacts and routes into the environment
The influence of temperature on the efficiency of electroplating from various ionic liquids