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Publisher: Emerald Group Publishing Limited

Volume 32, Number 2, 2006

Integrated waveguides for optical interconnects
pp. 3-7(5)
Authors: Sweatman, Denis; Powell, Olly; Francis, Shinoj

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Halogen-free laminates: worldwide trends, driving forces and current status
pp. 8-11(4)
Authors: Boysère, Jérôme De; Beard, Adrian

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De-mystifying materials selection for lead-free soldering
pp. 18-22(5)
Authors: Chen, Casper; Chiang, Joshua; Lee, F.Y.

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Dual metal core multilayer boards (MLBS) ‐ a better option for high speed spacecraft electronic packaging applications
pp. 30-38(9)
Authors: Rao, C. Hanumanth; Varghese, Jissy; Suresh, A.; Baliga, B.N.

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Stress analysis for fracturing potential of blind via in a build-up substrate
pp. 39-44(6)
Authors: Wang, Tong Hong; Lai, Yi-Shao

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