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Publisher: Emerald Group Publishing Limited

Volume 31, Number 3, 2005

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SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards
pp. 17-20(4)
Authors: Kim, Taehoon; Mok, Jee-Soo; Song, Chang-Kyu; Park, Jun-Heyoung; Kim, Kyung-O; Sun, Ben; Min, Byung-Youl

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New technologies for a sustainable printed circuit board manufacturing process: initial results
pp. 21-25(5)
Authors: Bains, Narinder; Geraghty, Kate; Goosey, Martin

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Environmental and economic implications of a shift to halogen-free printed wiring boards
pp. 26-31(6)
Authors: Bergendahl, Carl Gunnar; Lichtenvort, Kerstin; Johansson, Glenn; Zackrisson, Mats; Nyyssönen, Jonna

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